Signal Integrity Defeating Via Stubs and Resonance at Frequencies Beyond 110 GHz At frequencies exceeding 110 GHz, even microscopic via stubs act as accidental notch filters. Here is how advanced backdrilling tolerances impact high-speed signal pathways.
Signal Integrity Managing Impedance Fluctuation in Floating Board-to-Board Connectors Floating board-to-board connectors excel at absorbing mechanical misalignment, but their shifting internal geometry can wreck impedance profiles. Here is how to maintain SI.
Signal Integrity S-Parameter De-embedding and TDR Accuracy at 145 GHz Isolating connector performance from test fixtures requires flawless S-parameter de-embedding. Learn how to prevent mathematical artifacts from corrupting TDR simulation data.
PAM4 The 448 Gbps PAM4 Transition Chaos: Is Standard PCB Routing Dead? DesignCon 2026 exposed a major crisis: traditional PCB copper routing is hitting a brick wall at 448 Gbps PAM4. We analyze why over-board twinax cables are displacing board-level traces.
server backplane Next-Generation Server Backplane Architecture: Maximizing Data Throughput and Signal Integrity in Modern Blade Server Deployments Discover how modern server backplane and blade server backplane architectures handle massive data throughput while maintaining pristine signal integrity in high-density data centers.
backshell strain relief Maximizing Interconnect Longevity: Design Principles for Specifying Heavy-Duty Strain Relief Backshells in Mission-Critical Systems Discover the precise engineering mechanics behind strain relief backshells. Learn how to isolate delicate conductor joints from severe tension, bending, and torsional forces.
PAM-4 Navigating the Signal Integrity Nightmare of 224 Gbps PAM-4 Interconnects in Next-Generation AI Data Centers The jump to 224 Gbps PAM-4 signaling is pushing data center hardware to its absolute physical limits, transforming internal server connectors into high-stakes components.
Signal Integrity Taming Insertion Loss: Prioritizing Signal Integrity at High Frequencies Within Compact Footprints As operating frequencies climb across AI, data center, and automotive applications, keeping signal reflections low inside small enclosures is a critical discipline.
Board to Board High-Density Board-to-Board Interconnects: Mezzanine Design Mezzanine connectors allow for modular PCB stacking. We analyze the "stack height" and "pin density" requirements for modern high-speed compute modules and data center hardware.
Socket Troubleshooting Device Sockets: DIP, PGA, and BGA Impact Should you solder your IC or socket it? We explore the hidden electrical impacts of device sockets—from parasitic capacitance to thermal bottlenecks—to help you decide when the convenience of a socket is worth the trade-off.
Connector Impedance Matching in Coaxial and Concentric Connectors In RF engineering, a connector is more than just a plug—it’s a transmission line. This guide explains how to manage VSWR and impedance to ensure your coaxial connections don't become the primary source of signal reflection.
Signal Integrity Minimizing Contact Resistance: A Deep Dive into Plating and Signal Integrity High contact resistance is the silent killer of electronic systems. We explore the chemistry of plating—comparing gold and tin—to help you design interconnects that remain stable over thousands of cycles and harsh conditions.
